Wafer
singulation applications present several
challenges for motion system and component
suppliers. To meet these challenges, Aerotech
uses our patented technologies as well as our
vast experience in developing leading-edge
motion systems and components.
challenges for motion system and component
suppliers. To meet these challenges, Aerotech
uses our patented technologies as well as our
vast experience in developing leading-edge
motion systems and components.
S
O L U T I O N S f o r
W
A F E R S I N G U L A T I O N
High
accuracy, minimized dynamic yaw, and
excellent
dynamic straightness allow narrow
streets
for wafer dicing.
Scalable
mechanics allow wafers from small to large
(300
mm).
Minimized
planar flatness eliminates the need for
autofocus
on laser scribing systems.
Environmentally
protected stages allow long life and
less
maintenance.
150
- 20 µm die spacing
Precision
integration of the wafer chuck
allows
for reduced start-up costs
Optional
Z and
θ
mechanics allow
for
varying wafer thickness and
orientations
Direct-drive
technology
guarantees
consistent
Patented
braking mechanism
performance
over the life of
prevents
dither on rotary axis
the
product
during
mechanical scribing
Large
aperture allows for
operations
on the top and
bottom
of the substrate
Open
frame ALS3600