半導体

産業に関する主要専門知識

  • Thin Film Measurement
  • Wafer Inspection and Metrology
  • Maskless Lithography and Direct Write
  • IC and Wafer Packaging and Bonding
Wafer -Processing Wafer Processing

High Precision Inspection, Metrology, Lithography, and Direct Write

Enabling next generation wafer manufacturing and inspection processes


IC-and -Wafer -Packaging IC and Wafer Packaging

Die Attach, Bonding, and Inspection

Pushing the limits of precision, throughput, and reliability